各位版上先進,小弟近日錄取台灣村田(murata)職缺,內容為IC功能的測試及規格製定並 掌握下單之封測廠(封測廠大多在國內,但有時仍需出國)的量產情形,故所以也要了解封 裝的流程及相關製程,想請問版上對於這個工作內容及未來發展性的看法及高見!!! 在請各位不吝賜教了,謝謝大家!!! -- Sent from my Android -- ※ 發信站: 批踢踢實業坊(ptt.cc), 來自: 101.15.243.235※ 文章網址: https://www.ptt.cc/bbs/Tech_Job/M.1428162752.A.CB1.html※ 編輯: york19900527 (101.15.243.235), 04/04/2015 23:53:14
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